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PCB SMT&DIP Assembly

 

We have been assembling SMT designs for over 8 years now, and we take pride in the work we perform. Our employees are highly trained and considered professionals in the field. Here are some details about our services in surface mount assembly.

 




We work with both smt prototype and small production runs, using both manual and automatic smd assembly processes. We perform single and double sided placement of all component types. With us, you don't have to think about the details of production yourself and can focus on your design.

 

We can assemble:

  1. ☆ BGA
  2. ☆ QFN
  3. ☆ QFN
  4. ☆ SOIC
  5. ☆ QFN
  6. ☆ PLCC
  7. ☆ QFP
  8. ☆ UBGA
  9. ☆ POP
  10. and various other small chip packages that have a pitch of 0.2mm (8 mils) or larger. Through hole parts are also no problem. For passive parts, we can work with chip packages as small as 0201.


    Assembly Technical capacity

      SMT
    Position accuracy:20 um
    Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
    Max. component height::25mm
    Max. PCB size:680×500mm
    Min. PCB size:no limited
    PCB thickness:0.3 to 6mm
    PCB weight:3KG
      Wave-Solder
    Max. PCB width:450mm
    Min. PCB width: no limited
    Component height:Top 120mm/Bot 15mm
      Sweat-Solder
     Metal type :part, whole, inlay, sidestep
     Metal material:Copper , Aluminum
     Surface Finish:plating Au, plating sliver , plating Sn
    Air bladder rate:less than20%
      Press-fit
     Press range:0-50KN
     Max. PCB size:800X600mm
      Testing
     ICT,Probe flying,burn-in,function test,temperature cycling