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PCB Fabrication



Kingle has a complete bare board fabrication facility with all manufacturing processes in-house. When you place an order with GINGLE, you're dealing directly with the manufacturer, not a middle man. Our domestic production is focused on advanced technology, high quality, and time critical delivery while providing exceptional value. We provide extremely compressed lead times as well as right the first time engineering support. We don't compete on bottom line unit price, but we'll exceed any other manufacturer in terms of total value. Where price is paramount, we have partnered with quality off-shore vendors, so our customers can focus on their product development not complex oversea supplier management.


Kingle offers a wide variety of technologies, materials, lead times, and processes. Board types include standard rigid, high density rigid, chip carriers, high speed/RF, flexible & rigid flex, thermal management, prototype, and highly engineered. We also provide extensive engineering support for materials, impedance stack-ups, surface finishes, leading edge technologies, manufacturing guidelines and general applications support.

We tool over 250 unique part numbers per month and more than 30% of our orders are shipped in less than 5 days. We also build mission critical space and military electronics from 1 – 10,000, with each part ready for long term reliability in harsh environments. We service an incredibly diverse customer base of over 1,000 customers, none of which comprise more than 10% of our revenue.

Fabrication Technical capacity
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material
FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size
1150mm × 560mm
Aspect Ratio
18:1
Surface Finish
HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.


PCB Fabrication Process